SASTRA hosts Indo-Taiwan conference on chip packaging, testing

A two-day Indo-Taiwan conference on semiconductor packaging and testing was organised by SASTRA Deemed University in association with Lunghwa University of Science and Technology, with support from the SPARC scheme of the Ministry of Education, Government of India, recently.

A press release said Rao. R. Tummala, advisor to India Semiconductor Mission, highlighted the global transition from System-on-Chip (SoC) to System-on-Package (SoP) and discussed his proven model of establishing Industry Co-development Centres (ICCs) worldwide, which he is now working to replicate in India to support the growth of its semiconductor industry.

S. Vaidhyasubramaniam, vice-chancellor, SASTRA deemed university, underscored the university’s ongoing academic and research collaborations with Taiwanese institutions, noting that such partnerships are crucial for strengthening India’s semiconductor capabilities.

Experts from the semiconductor industry and academia in India and Taiwan addressed the conference, which saw the participation of more than 140 delegates representing 20 industries and 25 academic institutions.

On the occasion, a Memorandum of Understanding (MoU) was signed between SASTRA deemed university and PTW Semiconductor India Pvt. Ltd to foster industry-academia collaboration, the release said.

Po-Hsueh Chang of the Department of Semiconductor Engineering, Lunghwa University of Science and Technology; Venkatesh Kumar Pandurengan, General Manager, PTW Semiconductor India Pvt. Ltd, and R. John Bosco Balaguru of SASTRA Deemed University were present.