TAIPEI, March 18, 2026 /PRNewswire/ — In power electronics, MOSFET on-resistance RDS(on) typically increases as temperature rises, leading to higher heat generation, reduced efficiency, and potential thermal runaway. Para Light Electronics Co., Ltd. (6226.TW), a Taiwan-listed semiconductor packaging leader with over 35 years of expertise, today introduces a breakthrough solution: The ThermaFlat™ series of SiC MOSFETs. Suppressing Thermal Runaway Risk Leveraging decades of thermal engineering expertise, Para Light’s ThermaFlat™series delivers unprecedented RDS(on) stability across a wide operating temperature range from -25°C to +125°C. Most notably, the PC021S065ANC (650V) model maintains nearly constant resistance throughout this entire temperature span, paired with minimal switching loss. Even more remarkable is the high-voltage offering PD035S120ANC (1200V), which limits RDS(on) increase to a mere 26% over the same temperature range—a breakthrough performance that ensures superior system reliability, extended operational lifespan, and significantly lower thermal management costs. These advancements position the ThermaFlat™series as a game-changer, defining the new global standard for SiC MOSFETs. Technological Advancements for High Efficiency Beyond thermal stability, the ThermaFlat™ series incorporates a Kelvin source pin in the TO-247-4 package. This design choice empowers ThermaFlat™ to achieve a maximum 35% reduction in switching losses, providing an outstanding Figure of Merit (FOM) and a tangible boost to overall system efficiency for demanding applications. Strategic Applications The ThermaFlat™ SiC MOSFETs are specifically engineered for critical infrastructure and industrial sectors, including: Server power supplies for data centers and telecom infrastructure. PV Inverters and energy storage systems. EV Fast Charging and grid-tied systems. Industrial Drives such as servo motors, UPS systems, and welding machines. Setting a New Standard for Power Efficiency As global demand for high-efficiency power systems accelerates, Para Light’s entry into the SiC MOSFETs market delivers a definitive solution to long-standing thermal challenges. By merging advanced packaging technology with innovative thermal design, the ThermaFlat™ series sets a new benchmark for reliability and efficiency in next-generation power electronics. “This is a company press release that is not part of editorial content. No journalist of The Hindu was involved in the publication of this release.” Published – March 19, 2026 09:07 am IST Share this: Click to share on WhatsApp (Opens in new window) WhatsApp Click to share on Facebook (Opens in new window) Facebook Click to share on Threads (Opens in new window) Threads Click to share on X (Opens in new window) X Click to share on Telegram (Opens in new window) Telegram Click to share on LinkedIn (Opens in new window) LinkedIn Click to share on Pinterest (Opens in new window) Pinterest Click to email a link to a friend (Opens in new window) Email More Click to print (Opens in new window) Print Click to share on Reddit (Opens in new window) Reddit Click to share on Tumblr (Opens in new window) Tumblr Click to share on Pocket (Opens in new window) Pocket Click to share on Mastodon (Opens in new window) Mastodon Click to share on Nextdoor (Opens in new window) Nextdoor Click to share on Bluesky (Opens in new window) Bluesky Like this:Like Loading... Post navigation CIBF 2026 to Gather Global Battery Industry in Shenzhen This May, Opens Visitor Registration FBI investigating whether departed U.S. counterterrorism official Joe Kent leaked classified info