MUMBAI, India, March 13, 2026 /PRNewswire/ — On the sidelines of the 7th CII Datacenter Blueprint Summit, Refroid Technologies, the pioneer in high-density thermal engineering, and TierX Datacenters, a leader in rapid-deployment modular infrastructure, today announced a strategic partnership to launch India’s first completely indigenous, “Make in India” modular data center stack. The collaboration integrates Refroid’s proprietary liquid cooling systems—specifically Direct-to-Chip (DLC) and advanced Immersion Cooling—with TierX’s OCP-aligned (Open Compute Project) prefabricated architectures. This union creates a turnkey, sovereign foundation for the next era of decentralized AI, academic research, and edge computing, ensuring that India’s digital future remains independent of global supply chain dependencies. Direct-to-Chip (DLC) at the Core of Modular Scalability While the partnership covers the full spectrum of liquid cooling, the primary focus is the industrial-scale deployment of Direct-to-Chip (DLC) in Modular Data Centers. These factory-built, prefabricated facilities are engineered to support the massive thermal profiles of next-generation, high-TDP processors (exceeding 500W per socket) within a mobile and scalable form factor. Key Elements of the Sovereign Stack: ● Micro Data Centers for Research & Education: Specialized high-density units designed to bring supercomputing capabilities to university campuses and decentralized research laboratories. These units allow for rapid deployment of AI-ready labs without the need for traditional, brick-and-mortar data center construction. ● Prefabricated AI Modules: Fully integrated, liquid-cooled DLC blocks that provide hyperscale efficiency in a modular footprint, enabling industrial and scientific hubs to scale compute power as needed. ● Thermal Mastery in High Ambient Conditions: Proving that Indian engineering can lead the global map, the Refroid-TierX stack aims to achieve a benchmark PUE of 1.2, even in challenging high-ambient temperature regions, setting a new global standard for sustainable tropical data center design. Ravikumar Enamsetti, CEO of TierX Datacenters, stated: “TierX is redefining the velocity of infrastructure deployment. By merging our OCP-standard modular engineering with Refroid’s world-class thermal innovation, we are delivering a ‘Make in India’ solution that is fundamentally superior to imported alternatives. This partnership empowers our educational and research institutions with sovereign, secure, and scalable high-performance compute that can be deployed anywhere, from dense urban centers to remote campus sites.” Satya Bhavaraju, CEO of Refroid Technologies, commented: “This is more than a partnership; it is a declaration of Indian thermal sovereignty. By achieving a PUE of 1.05 in local ambient conditions, we are not just matching global standards—we are resetting them. Our DLC-enabled modular clusters, powered by our indigenous dielectric fluids co-developed with BPCL, ensure that the backbone of India’s AI and Research ecosystem is built on home-grown intellectual property, putting India firmly on the global map of advanced data center engineering.” The joint solutions will be featured at a forthcoming TierX Experience Center, providing live demonstrations of India’s first fully indigenous, liquid-cooled modular infrastructure stack to domestic and international stakeholders. About Refroid Technologies Refroid Technologies is India’s first end-to-end liquid cooling solutions company. With a mission to drive sustainability and thermal performance, Refroid specializes in Direct-to-Chip (DLC), Immersion Cooling, and Hybrid Load Banks, enabling the next generation of sovereign AI and HPC infrastructure. Website:https://www.refroid.com/ About TierX Datacenters TierX Datacenters is a next-generation infrastructure provider specializing in OCP-aligned prefabricated and modular data center solutions. TierX combines engineering speed with indigenous manufacturing to deliver the world’s most efficient and rapidly deployable digital foundations. Website:www.tierxdcs.com “This is a company press release that is not part of editorial content. No journalist of The Hindu was involved in the publication of this release.” Published – March 13, 2026 03:21 pm IST Share this: Click to share on WhatsApp (Opens in new window) WhatsApp Click to share on Facebook (Opens in new window) Facebook Click to share on Threads (Opens in new window) Threads Click to share on X (Opens in new window) X Click to share on Telegram (Opens in new window) Telegram Click to share on LinkedIn (Opens in new window) LinkedIn Click to share on Pinterest (Opens in new window) Pinterest Click to email a link to a friend (Opens in new window) Email More Click to print (Opens in new window) Print Click to share on Reddit (Opens in new window) Reddit Click to share on Tumblr (Opens in new window) Tumblr Click to share on Pocket (Opens in new window) Pocket Click to share on Mastodon (Opens in new window) Mastodon Click to share on Nextdoor (Opens in new window) Nextdoor Click to share on Bluesky (Opens in new window) Bluesky Like this:Like Loading... 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